Wireless IC tag joining method, wireless IC tag-carrying article, and vehicle

ABSTRACT

A flat IC tag contains memory means capable of data storage and transmission means capable of data transmission. The IC tag has on a surface thereof an unvulcanized rubber having identical properties to the unvulcanized rubber used for an article to which the IC tag is mounted. The opposite surface of the IC tag is mounted to the article before vulcanization. The article is vulcanized in this state to mount the IC tag to the article. Hence, the IC tag is not damaged if attached to tires and other articles in harsh operating environment.

TECHNICAL FIELD

The present invention relates to wireless IC tag securing methods formounting to articles wireless IC tags which can be read by means of, forexample, induced electromagnetic field without direct contact. Theinvention also relates to wireless IC tag carrying articles andvehicles.

BACKGROUND ART

In the management of manufacture, delivery, distribution, maintenance,etc. of tires for automobiles and other vehicles, one needs to knowquickly the unique information of individual tires: e.g., model number,serial number, specifications, properties, process history, and usagehistory.

Especially, the Product Liability law (PL law) provides that if aproduct inflicts any harm or damage on a person's life, body, orproperty due to a defect of the product, the manufacturer is responsiblefor compensating for the damage caused whether or not the incident isaccidental. The provision makes it essential for the manufacturer tomanage individual tires.

In addition, the American Department of Transport, or DOT, stipulatesthat the serial numbers of an individual tire and the vehicleidentification number (VIN) must be included in the warrant of the tireso that identification and storage is possible.

Conventional methods for marking the tire with the unique informationare disclosed in Japanese Unexamined Patent Publications 7-266811/1995(Tokukaihei 7-266811; published Oct. 17, 1995) and 2000-084681 (Tokukai2000-084681; published Mar. 28, 2000), among others. The formerdescribes a method of attaching a bar code sticker to the surface orinside a tire. The latter describes a method of engraving the tiresurface with an ID code.

However, these two bar code and engraving methods have the amount ofinformation limited by display area. In addition, the bar code andengraving may fade and become unrecognizable due to peeling, abrasion,or like causes. The bar code, in particular, can be smeared andillegible after use in severe environment. This problem is partlyaddressed by attaching the bar code sticker inside the tire; theinformation on the bar code sticker cannot be utilized after the tire ismounted to a vehicle.

Other methods propose mounting a non-contact data communications device.

An example is found in Japanese Unexamined Patent Publication11-102424/1999 (Tokukaihei 11-102424; published Apr. 13, 1999). There isprovided a buffer layer composed of a resin film containing gel resin.The layer covers a portion including the joint of a circuit board and anantenna coil. All these parts are in turn enclosed in packagingmaterial. This is intended to prevent external mechanical shock and thestress developed by deformation of an article itself from damaginginternal components.

Another example is found in Published Japanese Translation of PCTApplication 2001-525283 (Tokuhyo 2001-525283; published Dec. 11, 2001).An elastomeric material is provided to a circular part of a pneumatictire. A device capable of data processing and transmission, enclosed inthe elastomeric material, is mounted to the tire.

A further example is found in Japanese Unexamined Patent Publication2002-214060 (Tokukai 2002-214060; published Jul. 31, 2002). Theinvention is intended to protect sensors and electronic parts fromdegradation and destruction under pressure in vulcanization. The sensorsand electronic parts are mounted on a circuit board and sealed in ahousing, forming a transponder. A green tire with the transponderembedded between the inner liner and the carcass ply is vulcanized.After the vulcanization, the tips of protrusions of the housing areremoved together with part of the surface of the tire's inner wall, soas to form openings on the tips of the protrusions through which thesensor in the housing communicate with an air reservoir of the tire.

A still further example is found in Japanese Unexamined PatentPublication 2004-90775 (Tokukai 2004-90775; published Mar. 25, 2004).The invention is intended to prevent fracturing of an inexpensivefilm-shaped electronic device if it is mounted. The film-shapedelectronic device, freely slidable in sheet-shaped members provided onboth surfaces of the film-shaped electronic device, is attached insidethe tire or on the surface of the tire.

Still another example is found in Japanese Utility Patent Publication7-42514/1995 (Jitsukaihei 7-42514; published Aug. 4, 1995). Theinvention is intended to provide a sealed structure for a data carrierby a simple molding step which yet gives sufficient strength withoutdegrading the performance of the data carrier. The data carrier has arubber- and/or gel-like substance covering at least around a coil. Theentire data carrier is sealed with a sealing resin.

A further example is found in Japanese Unexamined Patent Publication11-85935/1999 (Tokukaihei 11-85935; published Mar. 30, 1999). Theinvention is intended to prevent an antenna coil from breaking due todeformation of an article itself containing a non-contact data carrierpackage. The antenna coil used is made of a metal line folded like abellow before being wound.

Another example is found in Japanese Unexamined Patent Publication2003-302290 (Tokukai 2003-302290). The invention is intended to providea temperature measuring data carrier which is capable of preciselymeasuring the continuously changing temperature of a heated object inreal time. The data carrier contains a base consisting of at least atemperature sensor section, a memory section, a wireless communicationssection, and a control section. The base has a surface covered with athermally insulating protection layer.

These methods and devices however give rise to problems if, for example,the devices are mounted to automobile tires or like articles whichexpand, shrink, and deform repeatedly in use. The non-contact datacarrier package may break in harsh operating environment. The tire orlike article itself may be damaged. Cost may increase.

In view of the problems, the present invention has an objective toprovide a method of securing a wireless IC tag which does not break ifit is attached tires and other articles which are used in harshoperating environment. It is also an objective of the invention toprovide an article carrying such a wireless IC tag and a vehicle towhich such an article is attached.

DISCLOSURE OF INVENTION

To address the problems, the wireless IC tag securing method, wirelessIC tag carrying article, or vehicle carrying the wireless IC tagcarrying article of the present invention is characterized by: coveringan entire first surface of a wireless IC tag with an unvulcanized rubberhaving identical properties to an unvulcanized rubber constituting anarticle to which the wireless IC tag will be secured, the wireless ICtag including memory means for storing data and wireless transmissionmeans for wirelessly transmitting data; mounting a second surface of thewireless IC tag which is opposite the first surface to the articlebefore vulcanization; and vulcanizing the article and the wireless ICtag to secure the wireless IC tag to the article.

In the present invention, the entire first surface of the wireless ICtag is covered with an unvulcanized rubber having identical propertiesto the unvulcanized rubber constituting the article to which thewireless IC tag will be secured. The unvulcanized rubber, composed ofuncrosslinked molecules, undergoes plastic deformation and, thanks tothe deformation, can protect the wireless IC from external forces.

The plastic deformation renders uniform the stress acting on thewireless IC during vulcanization. In other words, the unvulcanizedrubber serves as a buffer layer. Uniform pressure is exerted on thesurface of the wireless IC. Thus, the wireless IC tag main body, made ofa brittle material, becomes resistant to stress. The wireless IC istherefore protected from damage during vulcanization.

The unvulcanized rubber is denatured by the vulcanization for improvedelasticity and durability, to have identical properties to the articleto which the wireless IC tag will be secured. The use of theunvulcanized rubber having identical properties, even if the wireless ICis secured to an article in harsh operating environment, enables solidprotection of the wireless IC from damage when the article is in use.

If, for example, an elastomeric or other elastic material is used inplace of the unvulcanized rubber, the wireless IC receives an externalforce due to the repulsive force generated by elastic deformation. Thewireless IC is not sufficiently protected.

The article includes in the scope thereof tires for vehicles, such asautomobiles and trucks, and means of transport, such as motorcycles andbicycles, as well as things constructed of an article having a rubbermember, such as sports and other shoes with a rubber member as soles andrubber balls for basketball and other sports.

The memory means includes in the scope thereof things constructed of adata storage device, such as a non-volatile memory.

The transmission means includes in the scope thereof things constructedof a data transmission device with an antenna, etc. or a communicationsdevice for data transmission/reception with an antenna, etc.

The wireless IC tag includes in the scope thereof things constructed ofa tag containing an IC for wireless communications, such as those typeswhich include control means, such as a CPU or an MPU, to carry out datatransmission and those which include no control means, but operate inaccordance with signals received through a communications device.

The data includes in the scope thereof things constructed of informationwhich is requested for management, such as manufacture management,delivery management, distribution management, or maintenance management.Specifically, the data includes things constructed of unique informationof an individual article, such as the model number, serial number,specifications, properties, process history, and usage history of thearticle and any combination of these.

When the opposite surface of the wireless IC tag is attached to thearticle before vulcanization, it is desirable to attach it by adhesion.However, it is also possible to attach it simply by placing or equippingthe article and IC tag with an engagement projection and a cavity.

Attachment by adhesion desirably leaves no gaps or voids and includescomplete adhesion or excess void- and excess gap-free adhesion of thewireless IC tag and the article. Incidentally, it is desirable if the ICtag is adhered so that when the article deforms, the wireless IC tagdoes not deform to a different shape from the deformed article.

If the adhesion leaves no gaps or voids in this manner, the wireless ICtag, even if formed like a thin film, deforms in line with the deformedarticle. This prevents excess deformation of only the wireless IC tag,which may lead to breakage. Therefore, The antenna is protected fromline breaks and other damage.

The vehicle includes in the scope thereof things constructed of avehicle with a rubber tire, such as an automobile, a motorcycle,bicycle, etc.

The features enable the unvulcanized rubber (functioning as a protectmember) covering the wireless IC tag to alleviate the pressure exertedon the wireless IC tag due to the pressurization in the vulcanizationstep. Accordingly, the wireless IC tag is protected from damage andmaintains the functions of the wireless IC tag.

As an embodiment of the invention, the wireless IC tag may be secured tothe article at a place other than the joint of the unvulcanized rubberconstituting the article.

Accordingly, the wireless IC tag is prevented from being damaged by thejoint of the unvulcanized rubber during vulcanization.

The present invention enables the unique information of an individualarticle from the wireless IC tag mounted to the article. Especially, thewireless IC tag does not fade like bar codes or engravings. When the ICtag is mounted to the interior of the article, the unique information isstill obtainable by wireless communications. So, the unique informationis obtainable in any of the sale, use, and disposal stages of thearticle.

Additional objects, advantages and novel features of the invention willbe set forth in part in the description which follows, and in part willbecome apparent to those skilled in the art upon examination of thefollowing or may be learned by practice of the invention.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a plan view of the main body of an IC tag.

FIG. 2 is an illustration of manufacturing steps for a tire-mounted ICtag.

FIG. 3 is a cross-sectional view of a tire along its radius.

FIG. 4 is an illustration of manufacturing steps for an IC tag-carryingtire.

FIG. 5 is a partial perspective view of an IC tag-carrying tire.

FIG. 6 is an illustration of adhesion effect.

FIG. 7 is an illustration of a defect when adhered to a joint.

FIG. 8 is an illustration of manufacturing steps for an IC tag-carryingtire in a second embodiment.

FIG. 9 is an illustration of manufacturing steps for an IC tag-carryingtire in a third embodiment.

FIG. 10 is a perspective view of an automobile.

FIG. 11 is an illustration of a conventional IC tag-carrying tire.

BEST MODE FOR CARRYING OUT INVENTION Embodiment 1

The following will describe a first embodiment of the present inventionin reference to FIG. 1 to FIG. 10. The embodiment has an objective toprovide a wireless IC tag that is not damaged if mounted inside a tireor like article (i) which is elastic, pliable, and repeatedly deformedin use and (ii) which is subjected to harsh operating environment whereit is exposed to high temperature and high pressure for example, duringmanufacture and in use. It is also an objective to provide a method ofmounting such a wireless IC tag and a tire carrying the wireless IC tag.

FIG. 1 is a plan view of an IC tag main body 40 used in a tire-mountedIC tag 20 a.

The IC tag main body 40 includes a coil 42, a substrate 43, and an IC 44all provided on a label 41 made of a plastic or like resin. The IC tagmain body 40 is made from a sufficiently flexible and pliable, thin IClabel which is a rectangle when viewed from top. The overall size of theIC tag main body 40 may be comparable to or slightly exceeds that of athumb. The body 40 is a thin sheet. In the current embodiment, the body40 is shaped like a card. These are however by no means limiting thesize and shape of the IC tag main body 40.

The coil 42 is a conductive wire wound like a spiral along the edge ofthe label 41, functioning as an antenna. In the present embodiment, thecoil 42 is connected to the substrate 43 which is located close to acorner. The IC 44 is connected to the substrate 43.

The IC 44 contains a memory section storing data and a control sectionexecuting control operation.

The IC tag main body 40 may be, for example, the thin IC label proposedin Japanese Unexamined Patent Publication 2001-156110 (Tokukai2001-156110) or a similar IC tag. Such an IC tag, as popularly known,contains a resonator circuit, a rectifier circuit, a voltage sensorcircuit, a control circuit, a constant voltage circuit, etc.

The coil 42 and substrate 43 are disposed on the thin, flat label 41.The IC 44 is disposed between the substrate 43 and the label 41. To thisend, a part of the label 41 projects opposite the coil 42 and thesubstrate 43 to form a cavity. The IC 44 is placed inside the cavity.

Configured as above, the IC tag main body 40 is able to receiveelectromotive force through the coil 42 when in a magnetic fieldgenerated by a query device or like communications device (not shown).The control section executes control operation in accordance withincoming signals. The data in the memory section is transmitted.

Next, referring to cross-sectional side views in FIGS. 2(A) to 2(C)illustrating manufacturing steps for the tire-mounted IC tag 20 a, themanufacturing steps for the tire-mounted IC tag 20 a using the IC tagmain body 40 will be described.

<First Step A>

First step A will be described first in reference to the cross-sectionalside view in FIG. 2(A). A protective sheet 51 is stacked on a projectingside of the IC tag main body 40 on which the IC 44 is disposed. Theprotective sheet 51 is made of an unvulcanized pliable rubber memberexhibiting some plastic deformation property.

The projecting side is the side of the substrate 43 on which a conductorcircuit containing the IC 44 is formed. In other words, the projectingside is the one opposite the side where the substrate 43 is attached toa tire. In the figure, the side is depicted as the bottom.

The unvulcanized rubber member is preferably an unvulcanized SBR(styrene-butadiene rubber), an NBR (acrylonitrile-butadiene rubber), anethylene propylene rubber, a silicon rubber, butadiene, polyisoprene(natural rubber), etc. The unvulcanized rubber member has identicalproperties to those of the rubber member used for the tire 10(especially, the inner liner 14). Here, the “identical properties” meansthat the members possess properties as unvulcanized rubber, that is,plastic deformation property and exhibit elasticity throughvulcanization.

The IC tag main body 40 may be stacked on the protective sheet 51 whichis a sheet of the above rubber member by lamination. Alternatively, themain body 40 may be applied to the protective sheet 51 using a calendar,for example.

The protective sheet 51 is formed thicker than the IC 44 (for example,by two to five folds), preferably about twice as thick as the IC 44.

<Second Step B>

Next, in second step B, as shown in FIG. 2(B), an adhesive agent 32 isapplied to the back surface (bottom in the figure) of the substrate 43on which the conductor circuit containing the IC 44 is formed in the ICtag main body 40. The agent 32 has a good adhesion property with the rawmaterial (for example, SBR) of the tire to which the IC tag 20 a ismounted.

The adhesive agent 32 may be a rubber-based adhesive agent which isflowable at high temperature and high pressure and directly appliedusing a blade or a roll coater or by a like method. Alternatively, theadhesive agent 32 may be temporarily applied to a separator sheet (peelsheet) 31 before being transferred to the IC tag main body 40.

The separator sheet 31 is, for example, a paper base (paper sheet)having silicon applied to the surface thereof so that the sheet 31 doesnot stick to the adhesive agent 32.

As a result of these two steps A and B, the tire-mounted IC tag 20 a isfinished as shown in the cross-sectional side view of FIG. 2(C). Thetire-mounted IC tag 20 a can be adhered to a tire by means of anadhesive layer of the adhesive agent 32.

If the adhesive agent 32 is adhesive at room temperature, thetire-mounted IC tag 20 a may be used like a sticker. The separator sheet31 introduced in step B is removed before use.

In cases like this, the tire-mounted IC tag 20 a is readily fixed at apredetermined position. Another advantage is that the tire-mounted ICtag 20 a can be used even in vulcanization and other preceding steps.

Next, the tire-mounted IC tag 20 a fabricated in steps A and B above isattached to a tire in steps C and D.

FIG. 3 is a cross-sectional view of a tire along its radius. The tire 10to which the tire-mounted IC tag 20 a will be attached is constructed ofa tread 11, a belt 12, a carcass 13, an inner liner 14, a bead base 15,and a bead 16 as shown in FIG. 3.

The tread 11 is an outer skin of the tire and protects the carcass 13from abrasion and external damage.

The belt 12 is a reinforcement extending along the circumference betweenthe tread 11 and carcass 12 of the radial structure.

The carcass 13 is a fiber or steel wire framework of the tire. Thecarcass 13 supports the tire structure against load, shock, and internalair pressure.

The inner liner 14 a tube-equivalent rubber layer attached inside thetire.

The bead base 15 fixes the tire to a rim 99.

The bead 16 is a bundle of high-carbon steel and supports the carcasscord from both sides to fix the tire to the rim 99.

To the tire 10 arranged in this manner, the tire-mounted IC tag 20 a isattached as below.

<Third Step C>

In third step C, as shown in the cross-sectional side view of FIG. 4(A),the adhesive agent 32 of the tire-mounted IC tag 20 a is adhered to theinner liner 14 of the tire 10 to which the IC tag 20 a is mounted.

The adhesion position is specified close to the bead 16 (see FIG. 3)inside the tire 10 as shown in the partial perspective view of the ICtag-carrying tire 1 in FIG. 5. It is avoided to adhere the tire-mountedIC tag 20 a to a side wall 17 shown in FIG. 3 where the tire 10 showsespecially large deformation while the car is running. It is alsoavoided to adhere the tag 20 a to a rim contact surface of the tire 10where the tire 10 comes in contact with the rim 99, to prevent damage.

It is also avoided to adhere the tire-mounted IC tag 20 a to a joint ofthe thin rubber sheet of the inner liner 14 where both ends thereof areconnected together to form a circular body.

<Fourth Step D>

Next, in fourth step D, vulcanization is carried out to impartflexibility and durability to the tread 11, inner liner 14, and otherrubber members (for example, SBR) of the tire 10.

In this vulcanization step, or fourth step D, the tire is placed in ametal mold. Then, a pressure of about 25 atm and a temperature as highas about 180° C. are applied radially from the inside of the tire 10toward the outside, which direction is indicated by virtual arrows “a”in FIG. 3 inside the tire 10.

The atmospheric pressure value given above is only an ideal one and maybe variable approximately from 20 atm to 30 atm. The temperature valueis also an ideal one and may be variable approximately from 160° C. to200° C.

In the vulcanization process, the IC tag main body 40 adhered to thetire 10 is subjected to the same high temperature and pressure as thetire 10 which are harsh process conditions.

The front side of the IC tag main body 40 (opposite the tire 10) iscovered with the protective sheet 51. The sheet 51 is made of a pliablerubber member capable of plastic deformation which is an unvulcanizedSBR.

The protective sheet 51 serves as a buffer layer against the pressure,alleviating the pressure exerted on the IC tag main body 40.

Further, the protective sheet 51 is more pliable than the tire 10 (innerliner 14) to which the IC tag 20 a is mounted. This is because the tire10 is reinforced by fiber, for example, and the protective sheet 51 madeof unvulcanized rubber is less rigid than the tire 10. Being relativelypliable and deformable, the protective sheet 51 hence undergoes plasticdeformation under the heat and pressure during vulcanization and fitsonto the IC tag main body 40, as shown in the cross-sectional side viewof FIG. 4(B).

The plastic deformation results in uniform stress acting across the ICtag main body 40 during the vulcanization. With the protective sheet 51made of unvulcanized rubber serving as a buffer layer, uniform pressureis exerted across the surface of the IC tag main body. Thus, the IC tagmain body, made of brittle material, becomes resistant under stress. TheIC tag main body 40 is therefore protected from damage during thevulcanization.

The thermal insulation effect of the protective sheet 51 having asuitable thickness protects the IC 44 from high temperature during thevulcanization.

Possessing plastic deformation property, the protective sheet 51 showsplastic deformation under heat and pressure and expands by one size. Thesheet 51 thus sticks through fusing to the tire 10 (inner liner 14)along an edge (periphery) 51 a of the IC tag main body 40. The expansionfurther secures the IC tag main body 40 to the tire 10.

In this fashion, the IC tag main body 40 is enclosed, hence completelysealed, by the tire 10 (inner liner 14) and the protective sheet 51.

By these steps A to D, the IC tag-carrying tire 1 is manufactured whichgives durable data reading performance. Also by steps A to D, thetire-mounted IC tag 20 a is not damaged if vulcanized together with thetire 10 and firmly sticks to the tire 10 (inner liner 14) through fusingduring vulcanization.

More specifically, the adhesive agent 32, IC tag main body 40, andprotective sheet 51 are sequentially adhered to the tire 10 in steps Ato D as illustrated in cross-sectional side view of FIG. 6(A).

In the vulcanization step, or fourth step D, the protective sheet 51deforms and covers the IC tag main body 40 as shown in FIG. 6(B).Further, the adhesive agent 32 adheres the whole adhesion side surfaceof the IC tag main body 40 securely to the tire 10, leaving no gap orvoid therebetween.

Therefore, if the tire 10 deforms, for example, when the vehicle isrunning, the tire-mounted IC tag 20 a itself deforms in the same shapeas the tire as shown in FIG. 6(C).

If the adhesive agent 32 left a gap with the tire-mounted IC tag 20 abeing partially separated from the tire 10, the tire-mounted IC tag 20 awould deform, but assume a different shape from the tire 10 as shown inFIG. 6(D). This is because the tire-mounted IC tag 20 a is less thickthan the tire 10 and would bend in any direction it could bend.

If such a situation did occur, the IC tag main body 40 would bend at asharp angle and likely cause line breaks. In actuality, the tire-mountedIC tag 20 a is firmly adhered to tire 10 with no gap being lefttherebetween as shown in FIG. 6(C). This prevents the situation fromoccurring.

As describe above, as a result of fabrication of the IC tag-carryingtire 1, the tire-mounted IC tag 20 a becomes resistant to hightemperature, high pressure, and bending. Also, the IC tag main body 40does not break down when it is adhered to the tire 10 and is not damagedwhile the vehicle is running.

The tire 10 deforms repeatedly in ordinary use. The IC tag main body 40mounted inside the tire 10 also experiences bending forces repeatedly.In addition, heat is applied to the IC tag main body 40 from the tire 10which is heated to high temperature from friction with the road surfaceand for other causes.

However, the material used to mount the IC tag main body 40 inside thetire 10 securely and firmly adheres to the elastic tire 10 under hightemperature, high pressure process conditions by the adhesive agent 32filling up any space at the interface. By the vulcanization, thematerial is also denatured for improved elasticity and durability, tohave identical properties to the tire 10.

Therefore, the bend radius of the coil 42 which is a component of the ICtag main body 40 can be kept at a large value. No cracks or like defectsdue to difference in deformation capability of materials develop. Thebend radius of the coil 42 is defined as the radius of the coil 42 inreference to the center of curvature when the tire 10 deforms and thecoil 42 on the tag attached to the tire 10 bends accordingly.

The area near the bead 16 where the tire-mounted IC tag 20 a is adheredexperiences the least deformation when the tire is in use. In addition,in that area, the carcass 13 is closest to the internal surface of thetire 10.

In other words, the tire-mounted IC tag 20 a is firmly attached near thecarcass 13 which shows only a little deformation. Therefore, the bendradius of the tag 20 a is never large. The structure thus prevents linebreaks due to fatigue caused by repeated bending of the coil 42 which isa part of the IC tag main body 40.

Since the side of the substrate 43 where the IC tag main body 40 of thetire-mounted IC tag 20 a is mounted is placed near the surface of thehard carcass 13 in this manner, faulty contacts do not occur on the IC44, and short-circuiting is prevented between the IC 44 and the coil 42which is a conductor circuit.

The substrate 43 on which the IC 44 is mounted deforms as little as thetire 10. Line breaks due to deformation are also prevented.

In fourth step D, the deformation of the periphery of the IC tag mainbody 40 is absorbed by the protective sheet 51. Therefore, faultycontacts do no occur on the IC. Deformation of the substrate 43 on whichthe IC 44 is mounted is also prevented which would otherwise cause, forexample, a short-circuit between the IC 44 and the conductor circuit.

In addition, fabrication is possible by lamination which is suited tomass production. Manufacture cost is kept inexpensive.

The tire-mounted IC tag 20 a can be attached inside the tire 10; the ICtag main body 40 is therefore protected from external mechanical stressload when the tire is in use.

Further, it is avoided to attach the tag 20 a at the joint of the rubbersheet constituting the tire 10; the tire-mounted IC tag 20 a is notdamaged.

To explain in more detail, the both ends of the thin rubber sheet of thetire 10 are joined by a joint 14 a to form a circle as shown in thecross-sectional side view of FIG. 7(A), At the joint 14 a, theredevelops a step as shown.

If the IC 44 of the tire-mounted IC tag 20 a or the substrate 43 onwhich the conductor circuit is formed was placed at the joint 14 a inthird step C detailed above, and the tire was subjected to thevulcanization step under a pressure of about 25 atm and a temperature ashigh as about 180° C. with these components so placed, the tire-mountedIC tag 20 a would be damaged as shown in the cross-sectional side viewof FIG. 7(B).

In other words, the periphery of the IC 44 would deform due to a convex14 b made by the step at the joint 14 a. The deformation could causefaulty contacts between IC electrodes and the conductor circuits, forexample.

In the vulcanization step, a convex 51 b is formed on the internalsurface of the tire 10 by an air-venting groove (vent mark line) on thesurface of a metal mold (ladder) used in the vulcanization step.Deformation of the convex 51 b, on top of deformation of the convex 14b, would make faulty contacts more likely to occur between IC electrodesand the conductor circuit.

Incidentally, the deformation of the convex 51 b formed by the vent markline can be absorbed by the plastic deformation of the protective sheet51 on the surface of the tire-mounted IC tag 20 a. Therefore, if thetire-mounted IC tag 20 a is disposed on the tire 10 so that the IC 44 ofthe tire-mounted IC tag 20 a or the substrate 43 on which the conductorcircuit is formed is not placed at the convex 14 b formed by the step atthe joint 14 a, the problem of faulty contacts between the IC electrodesand the conductor circuit in vulcanization is solved.

Embodiment 2

Next, a tire-mounted IC tag 20 b which is a second embodiment will bedescribed in reference to the cross-sectional side views of FIG. 8(A) toFIG. 8(C).

In this embodiment, the protective sheet 51 of the first embodiment isreplaced by a protective layer 52 being either applied or stacked. Thelayer 52 is made of a thermoplastic rubber member which fuses at hightemperatures. The layer 52 is sandwiched by, for example, vulcanizedrubber sheets 33, 36 having some flexibility and durability, so as toform the tire-mounted IC tag 20 b.

The tag 20 b is attached to the tire 10 by the adhesive agent 32 appliedto the back of the substrate 43 constituted by a conductor circuit onwhich the IC 44 is mounted.

<First Step F>

In first step F, the protective layer 52 is applied to the side of theIC tag main body 40 which protrudes due to the mounting of the IC 44 asshown in FIG. 8(A). The layer is formed by applying a urethane-basedresin material which starts softening at a temperature around 150° C.using a roll coater or blade coater, for example the temperature valuegiven here is an ideal one and may be variable approximately from 130°C. to 170° C.

Next, the rubber sheets 33, 36 are secured by lamination or anotherprocess via adhesive agents 34, 35 to the respective sides of the IC tagmain body 40 to which the protective layer 52 is applied. The sheets 33,36 are an SBR having a thickness of about 0.1 mm which has beensubjected to vulcanization and is thus elastic. The thickness value isan ideal one and may be variable approximately from 0.05 mm to 0.15 mm.

These adhesive agents 34, 35 are preferably of the same kind as theadhesive agent 32 which attaches the IC tag main body 40 to the tire:for example, a rubber-based adhesive agent.

The rubber sheets 33, 36 secured to the respective sides of the IC tagmain body 40 are larger in area than the IC tag main body 40 so as tocreate, around the IC tag main body 40, edges where the rubber sheets33, 35 are secured. The IC tag main body 40 is hence sealed by therubber sheets 33, 36.

<Second Step G>

Next, in second step G, the tire-mounted IC tag 20 b fabricated in stepF is attached to the tire 10 (inner liner 14) using the adhesive agent32 as shown in FIG. 8(B). The position and attachment method is the sameas in the first embodiment.

<Third Step H>

Next, in third step H, the tire is vulcanized as shown in FIG. 8(C). Inthe tire-mounted IC tag 20 b, the protective layer 52 has a softeningtemperature that is lower than the vulcanization temperature. At hightemperature of the vulcanization step, the layer 52 softens and servesas a buffer for the IC 44 at high pressure.

The flow of the softened protective layer 52 is limited to horizontaldirections by the stacked rubber sheets 33, 36. The flow therefore doesnot degrade the stress buffering function due to a decrease in filmthickness.

The protective layer 52 absorbs heat when the layer 52 softens andfuses, which reduces heat conductivity. Less heat flows into the IC 44.The IC 44 is protected from heat.

By manufacturing the IC tag-carrying tire 1 containing the tire-mountedIC tag 20 b in the above manner, the IC tag main body 40 is not brokenwhen adhered to the tire 10 and not damaged due to traveling of thevehicles.

The protective layer 52 made of a thermoplastic rubber member absorbsheat as heat of fusion when the layer 52 fuses. Further, theliquefaction of the protective layer 52 reduces heat conductivity,lowering the temperature applied to the IC 44.

In addition, the aforementioned, dissolved thermoplastic rubber member(protective layer 52) is sealed between the rubber sheets 33, 36 locatedon and beneath that member, thereby preventing the tire-mounted IC tag20 b from flowing out. Therefore, the IC 44 is under uniform pressure.The resultant tire-mounted IC tag 20 b is thus more resistant to hightemperature and high pressure, compared to the tire-mounted IC tag 20 aof the first embodiment.

Embodiment 2 described above has other features and effects which arethe same as those of embodiment 1. The same members are indicated by thesame numerals, and detailed description thereof is omitted.

Embodiment 3

Next, A tire-mounted IC tag 20 c which is a third embodiment will be nowdescribed in reference to the cross-sectional side view of FIG. 9(A) andFIG. 9(B). In this embodiment, the tire-mounted IC tag 20 c is attachedto the exterior of the tire 10.

<First Step J>

First, as shown in the cross-sectional side view of FIG. 9(A), a sheetmaterial 61 is stacked via the adhesive agent 62 on the back of thesubstrate 43 where a conductor circuit which contains the IC 44 of theIC tag main body 40 is formed The adhesive agent 62 applied in advanceto the sheet material 61. The sheet material 61 is unvulcanized rubbermember having identical properties to the SBR which is a raw materialfor the tire. The sheet material 61 is 0.1 mm thick and is slightlylarger than the IC tag main body 40 in area.

The adhesive agent 62 used here is a rubber-based adhesive agent whichis flowable at high temperature and high pressure and direct applied tothe sheet material 61 using a blade or a roll coater or by a likemethod. Alternatively, the adhesive agent 62 may be temporarily appliedto a sheet which is made of a paper base with silicon applied to thesurface thereof, so that the sheet dose not stick to the adhesive agent62. Thereafter, the adhesive agent 62 is transferred to the sheetmaterial 61 so that the adhesive agent 62 is stacked on the sheetmaterial 61.

The sheet material 61 is an SBR. By making the sheet material 61 fromthe same raw material as the tire 10, cracks are prevented fromdeveloping around the IC tag main body 40 due to differences in quantityof deformation when the tire is in use. For the same reason, the IC tagmain body 40 does not peel off.

<Second Step K>

Next, in second step K, the tire-mounted IC tag 20 c is attached to thetire 10 as shown in the cross-sectional side view of FIG. 9(B).

To do that, the attachment position of the tire-mounted IC tag 20 c isspecified in proximity of the bead 16 (see FIG. 3) on the surface of theunvulcanized tire 10 before the tag 20 c is attached.

The adhesive agent 62 is of the same size as the sheet material 61 whichis larger in area than the IC tag main body 40 so as to create edgesaround the IC tag main body 40. The tag 20 c is attached by pressingthose edges of the adhesive agent 62 to the tire 10 (tread 11).

<Third Step L>

Next, in third step L, the entire unvulcanized tire 10 is placed in ametal mold in the tire 10 is vulcanized by applying a temperature ashigh as about 180° C. and a pressure of about 25 atm radially from theinside of the tire 10 toward the outside. This imparts high elasticityand durability to the rubber member to finish the manufacture of thetire 10.

At this stage, the sheet material 61 for the tire-mounted IC tag 20 c ispositioned in contact with the surface of the hard metal mold 63.Deformation of the substrate 43 to which the IC 44 is mounted isprevented. Further, the unvulcanized rubber member, of the tire 10(tread 11), which is capable of plastic deformation serves to preventhigh pressure from acting on the IC 44. In addition, the IC tag mainbody 40 and the tire 10 are joined at their interface under theapplication of high temperature and high pressure during vulcanization.

With these steps, the tire-mounted IC tag 20 c contains a reduced numberof parts than the tire-mounted IC tag 20 (or 20 a, 20 b, 20 c,individually) and fabricated at reduced cost.

The unvulcanized tire 10 is vulcanized after being placed in the metalmold. At that stage, the surface of the tire-mounted IC tag 20 c onwhich the substrate 43 carrying the IC 44 is attached is placed on thesurface of the metal mold 63 which is a hard base material. Therefore,the opposite surface has the same structure as the tire-mounted IC tag20 a of the first embodiment covered with a plastic rubber member.

Embodiment 3 described above has other features and effects which arethe same as those of embodiment 1. The same members are indicated by thesame numerals, and detailed description thereof is omitted.

The IC tag-carrying tire 1 of the embodiments described above enables aquery device, for example, to stably read the unique information ofindividual tires (e.g., model number, serial number, specifications,properties, process history, and usage history) from the IC tag mainbody 40 as data, no matter how old and how the tire has been used.

Accordingly, problems which may occur when the simply IC tag is mountedto the tire 10 are addressed.

non-contact IC tags, like the conventional IC tag, is capable ofcontaining a large quantity of information in the IC. The IC tag isreadable at distances from a few centimeters to a few meters by anon-contact method. The IC tag is still readable if the tag is insidethe tire.

However, some tire manufacturing steps, like the vulcanization step,inherently involve high temperature and high pressure. In addition, thetire may deform in use or may be heated to high temperature due tofriction with the road surface or for other causes.

Therefore, simply mounting the non-contact IC tag to the tire may resultin the non-contact IC tag being exposed to high temperature, highpressure, and other harsh environment and repeatedly bent. Theseconditions and deformation could break the IC, coil, and joints thereforwhich are components constituting the non-contact IC tag.

To prevent the non-contact IC tag from breaking, the IC section 123 of anon-contact IC tag 124 is sealed with a resin, such as epoxy resin 121,as shown in the cross-sectional side view of FIG. 11(A). Further, thecoil is made of a copper wire 122, for example, which is relativelyresistant to bending with a diameter of about 0.1 mm.

However, with these methods, the non-contact IC tag 124 losespliableness thereof if the tag 124 is solidly attached to a tire 127made of an elastic rubber member using an adhesive layer 126 as shown inFIG. 11(B). Cracks may develop inside the tire due to difference indeformation ability between the non-contact IC tag 124 and the tire 127,which could undermine safety provided by the tire.

Further, the hard epoxy resin 121 may break because the resin 121 cannotfollow the elastic deformation of the tire 127. The internal IC section123 will likely break contrary to expectations. Further, the methods addto the manufacturing steps for the non-contact IC tag and to the cost ofthe non-contact IC tag.

Each of the aforementioned embodiments is able to solve these problems.The user can obtain the unique information of individual tires using,for example, a query device as data in a stable manner.

Especially, the side of the IC tag main body 40 opposite the sidethereof where the body 40 is secured to the tire 127 is covered with anunvulcanized rubber having identical properties to the unvulcanizedrubber constituting the tire 127 to which the body 40 is secured. Thewhole tire is vulcanized in this state, which makes it possible tointegrate the IC tag main body 40 into the tire 127.

Unlike the technology disclosed in the prior art documents describedearlier in the BACKGROUND ART section, the use of an unvulcanized rubberhaving identical properties enables reliable protection of the IC tagmain body 40 secured to the tire 1 in harsh operating environment frombeing damages when the tire 1 is in use. In each of the embodiments, oneof the sides of the IC tag main body 40 is covered with an unvulcanizedrubber (protective sheet 51, protective layer 52, or sheet material 61)which have identical properties to the unvulcanized rubber constitutingthe tire 1. In unvulcanized rubber, molecules are not crosslinked andshows plastic deformation. The plastic deformation renders uniform thestress acting on the IC tag main body 40 during vulcanization. In otherwords, the unvulcanized rubber serves as a buffer layer. Uniformpressure is exerted across the surface of the wireless IC. Thus, thewireless IC tag main body, made of a brittle material, becomes resistantto stress. The wireless IC is therefore protected from damage duringvulcanization.

The unvulcanized rubber is denatured by the vulcanization for improvedelasticity and durability, to have identical properties to the tire 1.The use of the unvulcanized rubber having identical properties, even ifthe IC tag main body 40 is secured to the tire 1 in harsh operatingenvironment, enables reliable protection of the IC tag main body 40 fromdamage when the tire 1 is in use.

If, for example, an elastomeric, or other elastic material is used inplace of the unvulcanized rubber, the IC tag main body 40 receives anexternal force due to the repulsive force generated by elasticdeformation. The IC tag main body 40 is not sufficiently protected.

In each of the embodiments, the protective sheet 51, the protectivelayer 52, or the sheet material 61 completely covers one of the sides ofthe IC tag main body 40 so that no gaps or voids are left, beforevulcanization. However, the protective sheet 51, the protective layer52, or the sheet material 61 may leave some gaps (for example, holes oropenings smaller than the thickness of the protective sheet 51, theprotective layer 52, or the sheet material 61).

In a case like this, the gaps in the protective sheet 51, the protectivelayer 52, or the sheet material 61 are closed by deformation of theunvulcanized rubber near the gaps in vulcanization. Accordingly, the ICtag main body 40 is being prevented from damage during thevulcanization.

In addition, as shown in the perspective view of FIG. 10, bymanufacturing an automobile 100 to which the aforementioned ICtag-carrying tires 1 are attached, the tires of the automobile 100 canbe easily managed using the tire-mounted IC tags 20 (20 a, 20 b, 20 c).

The IC tag carrying article of the present invention is an equivalent tothe IC tag-carrying tire 1 of the embodiments in the relationshipbetween the features of the present invention and the embodiments. Inthe following, the article is similarly an equivalent to the tire 10.The unvulcanized rubber used for the article is an equivalent to theinner liner 14. The wireless IC tag is an equivalent to either thetire-mounted IC tag 20 a, 20 c or the IC tag main body 40. Thetransmission means is an equivalent to the coil 42. The unvulcanizedrubber on the IC tag is an equivalent to the protective sheet 51 and thesheet material 61. The vehicle is an equivalent to the automobile 100.The vulcanization is an equivalent to vulcanization step D. Theunvulcanized rubber is an equivalent to a rubber member, such as anunvulcanized SBR (styrene-butadiene rubber), an NBR(acrylonitrile-butadiene rubber), an ethylene propylene rubber, asilicon rubber, butadiene, or polyisoprene (natural rubber). The memorymeans is an equivalent to the memory section.

The present invention is not limited to the description of theembodiments above, but may be altered by a skilled person within thescope of the claims. An embodiment based on a proper combination oftechnical means disclosed in different embodiments is encompassed in thetechnical scope of the present invention.

INDUSTRIAL APPLICABILITY

As described in the foregoing, the wireless IC tag securing method,wireless IC tag carrying article, and vehicle of the present inventionare not damaged even if attached to an article in harsh operatingenvironment. During manufacture, sale, use, and disposal of the article,the unique information of the individual article is obtainable from thewireless IC tag mounted to the article. The invention is thereforeapplicable to general flexible, deformable articles which needs to storeunique information. Specific applications include various rubberproducts, such as the tires of automobiles, aircraft, and bicycles, aswell as shoe soles, volley balls and other balls, rubber members forvibration absorption, and rubber sheets.

1. A method of securing a wireless IC tag, comprising the steps of:directly covering an entire first surface of a wireless IC tag with arubber member consisting of an unvulcanized rubber having identicalproperties to an unvulcanized rubber constituting an article to whichthe wireless IC tag will be secured, the wireless IC tag includingmemory means for storing data and wireless transmission means forwirelessly transmitting data; mounting a second surface of the wirelessIC tag which is opposite the first surface to the article beforevulcanization; and vulcanizing the article and the wireless IC tag tosecure the wireless IC tag to the article, wherein the rubber membercovering the wireless IC tag has such a size that the rubber membercannot be secured directly to the article around the wireless IC tagbefore the vulcanization, but can be secured directly to the articlearound the wireless IC tag after the rubber member undergoes plasticdeformation and thus expands in the vulcanization.
 2. The method ofclaim 1, wherein the wireless IC tag is secured to the article at aplace other than a joint of the unvulcanized rubber constituting thearticle.
 3. The method of either one of claims 1 and 2, wherein theunvulcanized rubber covering the entire first surface of the wireless ICtag is softer than the unvulcanized rubber constituting the article towhich the wireless IC tag is secured.
 4. A wireless IC tag carryingarticle, in which: an entire first surface of a wireless IC tag isdirectly covered with a rubber member consisting of an unvulcanizedrubber having identical properties to an unvulcanized rubberconstituting an article to which the wireless IC tag will be secured,the wireless IC tag including memory means for storing data and wirelesstransmission means for wirelessly transmitting data; a second surface ofthe wireless IC tag which is opposite the first surface is mounted tothe article before vulcanization; and the article and the wireless ICtag are vulcanized to secure the wireless IC tag to the article, whereinthe rubber member covering the wireless IC tag has such a size that therubber cannot be secured directly to the article around the wireless ICtag before the vulcanization, but can be secured directly to the articlearound the wireless IC tag after the rubber member undergoes plasticdeformation and thus expands in the vulcanization.
 5. The wireless ICtag carrying article of claim 4, wherein the wireless IC tag is securedto the article at a place other than a joint of the unvulcanized rubberconstituting the article.
 6. The wireless IC tag carrying article ofclaim 4, wherein the unvulcanized rubber covering the entire firstsurface of the wireless IC tag is softer than the unvulcanized rubberconstituting the article to which the wireless IC tag is secured.
 7. Avehicle, comprising a rubber tire, in which: an entire first surface ofa wireless IC tag is directly covered with a rubber member consisting ofan unvulcanized rubber having identical properties to an unvulcanizedrubber constituting the tire to which the wireless IC tag will besecured, the wireless IC tag including memory means for storing data andwireless transmission means for wirelessly transmitting data; a secondsurface of the wireless IC tag which is opposite the first surface ismounted to the tire before vulcanization; and the tire and the wirelessIC tag are vulcanized to secure the wireless IC tag to the tire, whereinthe rubber member covering the wireless IC tag has such a size that therubber member cannot be secured directly to the tire around the wirelessIC tag before the vulcanization, but can be secured directly to the tirearound the wireless IC tag after the rubber undergoes plasticdeformation and thus expands in the vulcanization.
 8. The vehicle ofclaim 7, wherein the wireless IC tag is secured to the tire at a placeother than a joint of the unvulcanized rubber constituting the tire. 9.The vehicle of claim 7, wherein the unvulcanized rubber covering theentire first surface of the wireless IC tag is softer than theunvulcanized rubber constituting the tire to which the wireless IC tagis secured.
 10. The vehicle of claim 8, wherein the unvulcanized rubbercovering the entire first surface of the wireless IC tag is softer thanthe unvulcanized rubber constituting the tire to which the wireless ICtag is secured.
 11. The wireless IC tag carrying article of claim 5,wherein the unvulcanized rubber covering the entire first surface of thewireless IC tag is softer than the unvulcanized rubber constituting thetire to which the wireless IC tag is secured.
 12. The method of claim 1,wherein the rubber member is secured directly to the article around thewireless IC by fusing along a periphery of the wireless IC tag.
 13. Thewireless IC tag carrying article of claim 4, wherein the rubber memberis secured directly to the article around the wireless IC by fusingalong a periphery of the wireless IC tag.
 14. The vehicle of claim 7,wherein the rubber member is secured directly to the tire around thewireless IC by fusing along a periphery of the wireless IC tag.